Seiberg-Witten-Floer Homology and Gluing Formulae

Alan L. CAREY, Bai Ling WANG

Acta Mathematica Sinica ›› 2003, Vol. 19 ›› Issue (2) : 245-296.

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Acta Mathematica Sinica ›› 2003, Vol. 19 ›› Issue (2) : 245-296. DOI: 10.1007/s10114-003-0262-6
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Seiberg-Witten-Floer Homology and Gluing Formulae

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{{article.zuoZheEn_L}}. {{article.title_en}}. Acta Mathematica Sinica, 2003, 19(2): 245-296 https://doi.org/10.1007/s10114-003-0262-6

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