中国科学院数学与系统科学研究院期刊网
Seiberg-Witten-Floer Homology and Gluing Formulae
Alan L. Carey1 Contact Information and Bai Ling Wang2, 3 Contact Information
Seiberg-Witten-Floer Homology and Gluing Formulae
Alan L. Carey, Bai Ling Wang,
数学学报(英文版) . 0, (): 245 -296 .  DOI: 10.1007/s10114-003-0262-6